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Semiconductor failure analysis equipment - List of Manufacturers, Suppliers, Companies and Products

Semiconductor failure analysis equipment Product List

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Lock-in thermal analysis method

The lock-in thermal analysis method detects slight temperature increases in the current path.

- The IR-OBIRCH function is also included, allowing for further narrowing down of the fault location after identifying the heat generation area through IR-OBIRCH measurement. - By detecting infrared, it is possible to non-destructively identify fault locations without the need for opening the package through etching or removing electrodes. - By using lock-in signals, it is possible to identify heat generation areas with high S/N, enabling cross-sectional analysis such as Slice & View.

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  • Contract Analysis
  • Contract measurement
  • Contract Inspection

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TD Imaging | Semiconductor Failure Analysis Device (Heat Measurement)

By using heat reflection and laser technology, LIT narrows down the heat generation points beneath the metal layer, which were difficult to detect, to as small as 2μm, breaking through the limits of heat generation analysis.

TD Imaging is a new heat generation analysis method that uses a laser scanning thermal reflection technique developed and patented by Hamamatsu Photonics. Compared to a 1300nm near-infrared laser, a 670nm short-wavelength laser achieves over four times the S/N ratio on metal surfaces such as copper and aluminum. Furthermore, it can pinpoint heat generation locations down to 2μm, making it possible to identify defects beneath metal layers, which was difficult with conventional LIT. Additionally, by combining it with LIT, which excels in wide-area detection, the accuracy and efficiency of the entire analysis flow from electrical failure analysis (EFA) to physical failure analysis (PFA) are dramatically enhanced.

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  • Semiconductor inspection/test equipment
  • Defect Inspection Equipment

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